News

TSMC: This is what a high-end accelerator of the future looks like
Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...
Semiconductor Engineering11d
Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform
Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform,” 2024 IEEE 26th Electronics ...
Hosted on MSN27d
Rapidus to begin trial production of its 2nm process this month — Japan gets closer to cutting-edge silicon manufacturing
Work at RCS will include advancement of redistribution layer (RDL) interposer structures, three-dimensional packaging methods, assembly design kits (ADKs) for complex back-end operations ...
Taiwan News14d
Manz Asia establishes research center in Taiwan
TAIPEI (Taiwan News) — Manz Asia opened Monday a semiconductor R&D center in Taoyuan to develop advanced panel-level ...