Rohm has developed new 4-in-1 and 6-in-1 SiC muolded modules in the HSDIP20 package optimised for PFC and LLC converters in ...

Japanese semiconductor manufacturer Rohm has unveiled a new compact HSDIP20 package using 4th generation SiC MOSFETs. The Sic modules were specifically ...

When comparing a typical OBC PFC circuit utilising six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be ...

Compact high heat dissipation design sets a new standard for OBCs ROHM's new 4-in-1 and 6-in-1 SiC Molded Modules in the ...

ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package ...

KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC ...

When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to ...

KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant ...