Thanks to Intel's Foveros 3D packaging technology, the Lakefield processors are dramatically ... chipmaker's Foveros 3D packaging technology and a hybrid CPU architecture. The new 7-watt, dime ...

Bryant also revealed a new hybrid CPU architecture called Lakefield that "integrates different CPU core architectures into a single product.” Based on the company's Foveros 3D stacking ...

We are back after a week off! This week on the podcast we talk about our four reviews, big Intel Xe leaks, Apple possibly ...

It's the first laptop carrying an Intel Lakefield processor, a hybrid chip that's essentially Intel's attempt to take on the aforementioned Snapdragon series at its own game. Everything clear so far?

If you recall, Lakefield was Intel's first hybrid CPU where it married big cores with smaller ones where Intel married its Atom-based smaller cores with its bigger "Core" cores. Jasper Lake ...