With this package, military and aerospace customers have the flexibility to use their proprietary or preferred-vendor technology to attach columns or solder balls to the LGA package. Customers will ...

Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is ...

Murata has introduced non-isolated point-of-load (PoL) DC-DC converters which are notable because they are in an inspectable Land Grid Array (iLGA) package that allows for probing of all signal pads ...