What to do? Build an interposer, of course. You can bring the module up to date by sending some extra init commands to the GPS chipset during bootup, and, firmware hacking just wasn’t the route.

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

On-die Digital Impedance Sensing for Chiplet and Interposer Verification” was published by researchers at Worcester Polytechnic Institute. Abstract “The increasing complexity and cost of manufacturing ...

POET Technologies Inc.’s POET share price has surged by 5.47%, which has investors questioning if this is right time to sell.

One is called an interposer, a layer of material that the AI chip sits atop to connect to neighboring chips that also sit atop the interposer. The other is a small tile called a "chiplet" that can ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

The Humane Ai Pin is a wearable, internet-connected AI device designed to offer a phone-free way to interact with an AI ...

Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI, and networking applications. The PHY’s ... The ...

SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close ...