Reacting to this intense price pressure, Korean DRAM firms are reducing their DDR4 production and shifting to DDR5 and HBM3 memory - ICs that Chinese vendors cannot mass produce right now.

China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current ...

Selling Micron Technologies in the current environment isn't sensible due to its strong US manufacturing footprint and competitive HBM product ...

JEDEC has announced the publication of its HBM4 standard: up to 8Gb/s across a 2048-bit memory interface, HBM4 offers up to ...

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...

At long last, HBM4 is officially here—at least as a specification. The JEDEC released Standard 270-4, supplying high ...

applications requiring high-bandwidth HBM3 DRAM interfaces operating at up to 9600 Mbps. The synopsys HBM3 PHY offers superior power efficiency compared to any other off-chip memory interface and ...

applications requiring high-bandwidth HBM3 DRAM interfaces operating at up to 9600 Mbps. The synopsys HBM3 PHY offers superior power efficiency compared to any other off-chip memory interface and ...

The JEDEC Solid State Technology Association, the global developer of standards for the microelectronics industry, has ...

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry ...