And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

United Microelectronics shares are down in premarket trading, despite reporting a 4.25% increase in February sales ...

Primary replacement options are one-piece tube brooms, flat or convoluted wafers, and strip brooms, and all have their specific applications, reasons for use, and advantages and disadvantages.

Among them are: 300mm wafer demand is flat after a period of growth. 300mm wafer supply is loosening up, while 200mm is tight. Worldwide capacity utilization for 300mm wafers will hover around 95% in ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The Proforma 300SA is a semi-automated ...