EDA vendors are taking aim at new ways to improve the productivity of design and verification engineers, who are struggling ...

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog EDA (electronic ...

SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

As chips become increasingly compact and powerful, efficient heat dissipation will be crucial to maintaining their performance and longevity. To ensure this efficiency, we need a tool that can predict ...

Chiplets can bring together different die technologies together in a single package to address AI/ML applications (see figure). This is already being done but in a proprietary fashion by large OEMs ...

Big speed gains but no SPR for now TSMC has rolled out its new A14 node, marking its first foray into the 1.4 nm-class ...

Chip designers are often stuck between a rock and a hard place. Not only are they dealing with staggering design complexity, but they're also under pressure ...

Hub, in collaboration with Atal Innovation Mission (AIM), was awarded the prestigious Best Conceived Cohort 2025 for its AIC ...