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TSMC takes 'chip binning' to a whole new level as entire wafer 'found in a dumpster'
Instead it's a test wafer containing dummy circuitry layouts used to evaluate the performance and calibration of the hyper-complex lithography machines that etch the patterns onto the wafer that ...
Design-Reuse4y
Methodology to reduce Run Time of Timing/Functional Eco
It is an important step in IC fabrication process. To achieve the planarity of the surface of wafer, dummy metal fills are required to be inserted to have even distribution of the material on the ...