Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources ...

That tradition continues in 2023, with [Scott M. Baker] producing a brand-new DRAM board that’s compatible with any version of the H8. Although the Heathkit H8 was designed around the Intel 8080 ...

HBM features a stacked DRAM (Note 2) structure, requiring technology capable of fabricating wafers even more thinly and precisely. This configuration also requires that the PCBs used in inspection ...

TL;DR: SK hynix has improved its 1c DRAM yields from 60% to over 80%, focusing on HBM for AI GPUs. The company developed the first 1c process-based 16GB DDR5 DRAM and will lead in mass-producing ...