3D-IC technology is a solution that interconnects back-end-of-line (BEOL) bottlenecks, offering significant PPA benefits enabled with fine pitch 3D interconnect and fine grain functional partitioning.

IGZO DRAM cells hold tremendous promise for analogue ... Additionally, IGZO transistors can be processed in the chip’s back-end-of-line (BEOL), allowing for placement on top of the peripheral ...

This PDK enables the integration of the Company's advanced EO polymers into Silicon Photonic Integrated Circuits (Si-PICs) using Lightwave Logic's novel Back-End-of-Line (BEOL) process.

Also, Micron's 1γ DRAM process technology adopts next-generation high-K metal gate technology and an all-new back-end-of-line ...