Researchers at the University of Tokyo have developed a 3D cooling system that uses boiling water to dissipate heat from ...

Researchers have demonstrated a significant performance increase in cooling technology for high-power electronic devices. They designed novel capillary geometries that push the boundaries of thermal ...

Researchers built a 3D capillary system that allows water and steam to flow freely within it to dissipate heat efficiently.

As chips get smaller and more powerful, keeping them cool becomes a serious bottleneck—until now. A research team from the ...

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