3D-IC technology is a solution that interconnects back-end-of-line (BEOL) bottlenecks, offering significant PPA benefits enabled with fine pitch 3D interconnect and fine grain functional partitioning.

This PDK enables the integration of the Company's advanced EO polymers into Silicon Photonic Integrated Circuits (Si-PICs) using Lightwave Logic's novel Back-End-of-Line (BEOL) process.

"SMIC's 0.11um Cu-BEoL process has long been recognized by our customers for its high stability. We have an accumulative shipment of more than 100,000 wafers adopting SMIC's 0.11um IP library on our ...

A new technical paper titled “Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks” was published by researchers at IBM Research Europe and ...