Deal shows Applied Materials not developing alternative to BESI's hybrid bonding tech ... hybrid bonding occurs much closer to the chip's production line and work together with Applied Materials ...

(Reuters) -Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI), the U.S.-based computer ... much closer to the chip's production line and work together with Applied ...

BESI's shares rose 9% in early trade and could ... hybrid bonding occurs much closer to the chip's production line and work together with Applied Materials' tools. "I think shareholders will ...