As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for new process ...

Others are exploring the idea. Generally, copper is still used for the other and traditional backend-of-the-line (BEOL) layers. Cobalt is mainly used for the liners here, although ruthenium is gaining ...

"SMIC's 0.11um Cu-BEoL process has long been recognized by our customers for its high stability. We have an accumulative shipment of more than 100,000 wafers adopting SMIC's 0.11um IP library on our ...

Dr. Haksoon Jung, the lead author, said, "The major advantage of our technique is its compatibility with existing silicon semiconductor back-end-of-line (BEOL) processes, as it can occur at ...