This PDK enables the integration of the Company's advanced EO polymers into Silicon Photonic Integrated Circuits (Si-PICs) using Lightwave Logic's novel Back-End-of-Line (BEOL) process.

3D-IC technology is a solution that interconnects back-end-of-line (BEOL) bottlenecks, offering significant PPA benefits enabled with fine pitch 3D interconnect and fine grain functional partitioning.