As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for new process ...

A new technical paper titled “Textured growth and electrical characterization of Zinc Sulfide on back-end-of-the-line (BEOL) compatible substrates” was published by researchers at USC, Lawrence ...

"SMIC's 0.11um Cu-BEoL process has long been recognized by our customers for its high stability. We have an accumulative shipment of more than 100,000 wafers adopting SMIC's 0.11um IP library on our ...