Kioxia's new 3D flash memory features a CMOS directly Bonded to Array (CBA ... as it was also featured in Kioxia's 8th generation 3D NAND products. However, the larger highlight is the new ...

One of the things that every student of digital electronics learns, is that every single logic function can be made from a combination of NAND gates ... TTL and CMOS logic chips made their ...

The underlying architecture of HBF is SanDisk's BICS 3D NAND using the CMOS directly bonded to Array (CBA) design that bonds a 3D NAND memory array on top of an I/O die made using logic process ...

YMTC is known for its design and fabrication of 3D NAND, a flash memory in which transistor dies are stacked vertically to increase storage density. Patent applications made public in late March ...

Workarounds include stacking more layers on top of each other (3D NAND) and increasing the number of voltage levels – and thus bits – within an individual cell. Although this has boosted the ...