Cadence furthered its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node ...

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor ...

A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...

Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

In the collaboration, AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality ...