“They don’t have strict design rules. On the chip side, they have very strict design rules. There’s going to be a lot of design rules they have to adhere to in a 2.5D flow. That will limit the danger ...

The second group would be 3D system-on-chip (SoC) integration, where you might have a backside power distribution layer, or a wafer-to-wafer stack of memory. The third group includes 2.5D and silicon ...

Over the past ten years, 2.5D integration has proven beneficial ... TSMC’s leading-edge logic processes with cutting-edge 3D chip stacking technologies. Together, we are excited to bring ...